Yes, the surface tension of melted solder pulls the solder to just the pad areas (assuming you don’t have far too much)

Using with a little flux while tinning usually prevents the pads from bridging

To add to the sister comments, you can quite easily remove such bridges by adding flux and then touching each individual pad with a fine tipped soldering iron. It sometimes takes a few tries, but eventually the solder that’s touching the solder mask will either be wicked onto the iron or move onto one of the neighboring pads. (The trick is to touch just the pads with the iron, and not to try to attack the solder bridge itself.)