They might be behind by at most a decade in packaging dies like those used for desktop/server CPUs or for GPUs, which are no longer produced currently in Europe.

On the other hand, in other application domains, like the packaging of power semiconductors, they are at least at the same level, if not more advanced than USA. The same is true for the packaging of chips with up to a few hundred pins.

Historically, a large fraction of the innovations in the packaging of semiconductor devices and integrated circuits have originated in Europe, at companies like Philips, Siemens, Thomson, SGS-ATES, before being adopted also by the US companies, some years later.