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Well, Taalas has that kind of technology, but the chip they demoed is probably 20-100 times smaller than necessary since it's only an 8b model.

But let's say they could someday scale that up to a much larger model, 72 large chips per wafer and each chip can do 1000 LLM requests at once (Vera Rubin?). So it's roughly the equivalent of an NVL72 rack.

You might be able to serve something like 50000-60000 requests at once. So I think it's more like handling a small city's worth of customers per wafer than the world if you had that.

I believe in less than 5 years we will get to that, but the model size and/or number of agents is going to keep going up also.

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You’d never be able to update it’s knowledge.

LLMs need retraining to incorporate new knowledge.

Baking them into wafers means they will be out of date by the time they finish the first wafers.

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Yes, of course, but all the LLMs are already out of date, so that doesn't seem to me to be a hard limiting factor. Even if they had a knowledge basis ~3 months out of date additionally, being able to serve 100x the requests per watt seems totally reasonable to me.
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So, what?

I don't see the C++ compiler standards or Newton's laws changing every day.

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I think the future will have to include specialised host boards for memory chips.

What I actually want is an FPGA board with a very large number of DDR3/DDR4 RAM slots arranged in banks (2, 4, 8 or even more banks). I want an FPGA board that can hold 1TB of DDR3/DDR4 RAM.

The throttling point right now is not RAM, it's bus speed. Having different busses for banks of RAM alleviates that.

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