I feel like what we really need is the ability to solder computer cache on all sides of the chip Meaning above and below as well. If you can only attach it to the edges you will be inherently physically limited on the amount you can put (and maybe even have latency benefits as well)
Talaas is different, it's a true compute-in-memory architecture where the weights are stored in the connections between the transistors that perform the matrix multiply, rather than in seperate memory cells.
Most of the benefit comes from this architecture; hardwiring the weights into the silicon is just the easiest way to implement it. SRAM requires too many transistors, DRAM requires an incompatible manufacturing process, and exotic phase-change memories aren't readily available.
With that kind of speed and if even lower power requirements, they could release mini compute units with USB4/Thunderbolt for plug and play inference.
I agree that Groq with multilayer hybrid bonding could be a good idea.