I wonder if we might eventually see stacking of NAND, logic, and DRAM dies together so each can still be fabbed on their specialized process. Getting all three on one wafer is extremely impractical, but having them all connected with TSVs or other bonding might be feasible, if the density of the respective dies works out right to give you the right ratio of storage for weights, working memory, and compute.
replyIt’s SRAM that’s expensive, and more so as the nodes get smaller since the logic gets smaller but not the SRAM, which means it takes up a larger percent of die area over generations.
replyIsn't Intel effectively betting the farm on this right now? Other than stacking technology, what do they have that's even a little interesting?
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