There are specialized shops willing to do this around the world. This is especially common in third world countries, Eastern Europe, China etc.. There are people who would do this change for around 5-10 USD in India (as long as you can find the replacement yourself).
I am amazed at how many people on this forum think of this as some scary dark magic.
One can also DIY such mods/repairs but it requires some extra equipment and supplies.
Also they not only solder DRAM, now they solder keyboards so that you cannot replace it easily. My garbage keyboard broke after just 2 years of using and I had to solder ~100 plastic pins to replace it (and the replacement keyboard turned out to be not of a great quality).
Perhaps for you, but I very much care about my laptop's size and especially it's weight, as I carry it around on a daily basis.
Repairing or upgrading it aren't really of interest to me, as I wouldn't be able to aquire the parts where I typically live anyway. And performance and cooling have already been more than good enough for me in most laptops for the last decade.
If you want the battery life improvements, bear in mind that there is a hard limit on how large a battery you are allowed to fly with, so low power components are important.
Not to mention how often I long for my MBA11 with the tapered body which almost made it feel like it was floating in my lap when working from the couch.
Could it be that thin laptops are largely an excuse to provide a need to solder RAM; which in turn encourages consumption through obsolescence?
Unfortunately, not many people making those claims _actually_ want them by revealed preferences. They overwhelmingly want the lower price laptops with similar performance specs.
I like and support what Framework offers. But when I last bought a laptop (a couple of years ago now) the FW13 was almost double the price of a similarly-specc’d and thinner/lighter Asus. (From €1000 to ~€18-1900).
I’d probably pay a ~40% premium for FW, all else being equal, but 80-90% is just too much: it just doesn’t make sense to whatever value-assessment algorithms I’ve developed over time.
The LP in LPDDRx isn't about creating thinner devices.
The LP stands for Low Power and is aimed at making devices that draw less power resulting in a longer battery life.
https://frame.work/blog/framework-laptop-13-pro-deep-dive-lp...
I've been eyeing LPCAMM2 interposers for non-RAM uses - as an off the shelf connector for stacked PCB designs. The conclusion was that it wasn't produced or used at sufficient scale for it to work.
https://www.koreatimes.co.kr/business/tech-science/20260420/...
I've found just one store that carries them, but seeing as they reported "50+ units in stock" I called the store and learned that "the item is available through a third party vendor within four business days", but looking at that the ratings it would be more like three weeks.
Can't you select and copy the text in the photo (on most smartphones and PCs at least)?
Optimal: piecemeal. As in: X sockets on a board, each socket takes a chip that adds CPU core(s), GPU cores, and some amount of main RAM. More chips, more powerful computer.
Keyword: socket. Read: replaceable. Bad chip out, good chip in. Slow chip out, faster chip in. Soldered onto board = reliable, but a defect could junk the whole machine.
Putting RAM inside the logic die is crazy expensive - just look at how much footprint L3 cache takes up on a modern chip. It'll always make more sense to put it in a separate die, made using RAM-specific processes. With Zen the memory controller and GPU has (once again) moved to a separate die, and with X3D we're now even seeing separate cache dies.
There's of course HBM if you want to consider that "integrated", but the large cost bump, additional manufacturing risks, and loss of flexibility don't make that an attractive proposition unless you really need the extra speed. Regular DDR dies? You gain basically nothing by co-packaging those.
Haven't Apple (A-series, M-series) and others been copackaging memory for a while? (SiP or MCM?)
Then there is the HBM which is an expensive process to mount on the chip.
Smartphones also need RAM and are especially subject to requirements of always being thinner, lighter, and have a durable battery, yet have spacious amounts of RAM.
Growing demand for smartphone RAM pushed for its optimization and production scaling and since all its requirements also match laptops, this convergence was inevitable.
Hopefully the growing demand for datacenter RAM density will make modular interface standards like LPCAMM2 more available (soldered has no place in datacenter).
The issue, of course, is just how much time, effort and skill is required to do it.
It might become a viable commercial process outside third world countries if RAM prices spike even more - or if someone finds a way to teach an off the shelf $1000 robot arm advanced autonomous microsoldering.
Then there's the problem of forcing the device itself to recognize the new RAM. It's a device-specific trick. RAM sticks have a little tag chip that tells a PC "how much RAM this stick has", but RAM chips themselves don't - so the device has to infer its RAM capacity from elsewhere. Like strap resistors on the board. Which you have to find and adjust for the new RAM capacity. That, or fix the RAM values in firmware, which is also device-specific.
I'm surprised that in 2026 this is still true.
You could easily fit a little microcontroller on the die of each RAM chip which reports its make/model/manufacturing date, capacity and capabilities, can be triggered to run self-tests, etc. If they aren't doing that yet, I'm surprised that they aren't.
As for the videos and the Macs, you can see the same people (likely) soldering RAM as well.
I'm assuming if it were still under warranty, dead RAM chip would be enough to get a free repair/replacement from the manufacturer
Good BGA experience and a steady hand seems required
And yeah, it can be, but that's how you end up with the far slower regular DDR. Fast, repairable, cheap: pick (at most) two.
I agree there is draw back when using socket(mostly size), but performance is not the big issue.
MRDIMM RAM can reach even higher Transfer rate than LPDDR5, yet still socktable.
CPU and RAM are socketed. Clevo had socketed graphics cards too
Besides, since RAM isn't getting cheaper for a while, this isn't a big issue now.
I would argue the exact opposite, actually! My home machine has 32GB of RAM and is already over 7 years old. If it were to die right now I'd ideally go for an upgrade with 64GB so it would be good for another 7 or so. But that's completely unaffordable, and I could survive with 16GB for a year or two, so going for the bare minimum now and upgrading it later is looking very attractive...
At work, the standard issue laptop is some form of HP Elitebook. These have been getting thinner, and people seem to like that. We're not a tech shop, and even the IT dept. is mainly barely-technical project-managers. An 8th gen i5 would be plenty powerful for what they do, but fortunately for them we have to replace the laptops regularly because for some reason we buy them with the least amount of RAM possible (even before the prices exploded).
Anyway, at the start of the year I was fed up with the ridiculous screen quality of the HPs and other annoyances, so I got myself an Lenvo p14 something-or-other. It's almost twice as thick and much heavier than the HPs, and everyone who sees it makes fun of it.
"Smartphone makers glue them because it's cheaper and they can make more money ..." No. It's what the consumers want. Thinner phones, water resistant phones, and thinner laptops.
Water resistant? Those ratings are lies anyways, and nobody is going to bring their expensive smartphone on a diving trip to take pictures - or even take it surfing without a waterproof case. In practice "water resistant" means "won't die from an occasional splash", and that can be achieved perfectly fine by repairable phones.
Now, I don't know about surfing, but I regularly strap my iphone to my motorbike's handlebars to use as a GPS. No case. I don't particularly enjoy doing this under pouring rain, but it does happen, and the phone gets drenched. However, to the point about people wanting this, yes, I do. I would also love a replaceable battery. My old Galaxy S5 had both features, so saying that waterproofing means non-user-replaceable battery is a lie.