These realtek 10gbe chips are more in the range of the Pi Zero class machines (0.5W idle, 2W loaded) which don't often come with heatsinks though they might benefit from them. If it has a good thermal connection to a good thick ground plane on the PCB, that's worth almost as much as a passive heatsink on the top of the chip.
usb-c < card edge < motherboard integrated in terms of how much heat can be transfered through the connection. Where the motherboard would have the largest ground plane to soak up heat from such an IC and dissipate it passively. The usb-c module is worst case by being a small enclosed box with very little thermal connection through the plastic insulating housing. An aluminum enclosure might dissipate enough heat passively to make it pleasant to use.
Even with a heatsink and fan, I had to upgrade to a higher quality set to keep Jellyfin from thermal throttling a Pi5 while transcoding 4K video.
(Technically the Pi 4's hw encoder doesn't go up to 4K either, though, so I guess moot point).
Another way is that my great grandchildren won't care about inheriting my collection of hobbyist SBCs, and therefore nor should I.
Subsequently, in 1967, Black of Motorola experimentally derived a median time to failure (MTTF, i.e., operational lifetime) model for EM in Al interconnects, showing that the time to failure due to EM is inversely proportional to both the current density and the absolute temperature of the interconnect.
[1]: https://infinitalab.com/blog/ic-failure-analysis-defect-type...
[2]: https://resources.system-analysis.cadence.com/blog/msa2020-b...
[3]: https://www.mdpi.com/2079-9292/14/15/3151#sec3-electronics-1...
* https://en.wikipedia.org/wiki/Ethernet_over_twisted_pair#Var...